Features

• Applicable process:After SMT solder paste printing, before/after SMT reflow soldering, before/after DIP wave soldering.
  
• Programming mode:Manual writing, automatic writing, CAD data import and automatic corresponding component library.
  
• Detection type: Solder paste printing: presence or absence, offset, less tin, more tin, open circuit, continuous tin, pollution, scratched tin beads, etc.
  
• Part defects: missing parts, multiple parts, offset, skew, tombstone, side standing, overturned parts, wrong parts, damaged, reverse, XYθ offset data output, etc.
  
• Solder joint defects: too much tin, little tin, false solder, continuous tin, tin balls, glue overflow, no lead out, copper foil pollution, etc.
  
• Calculation method: Vector analysis, color calculation, color extraction, grayscale calculation, image comparison, etc.
  
• Detection mode: Optimized inspection technology covering the entire circuit board, puzzle and multi-mark, including Bad mark function
  

Parameters

Camera: 5 million full color high-speed industrial digital camera.

Lens resolution: 10um/15um/18um/20um/25um, can be customized for special applications

Light source: Annular stereo multi-channel color light, choose RGB/RGBW/RGBR/RWBR depending on the application.

Transportation and inspection method: Manual pick and place board, Y servo motor moves PCB, X servo motor drives camera to take pictures.

PCB size: 20*20mm(Min)～450*350mm(Max), can be customized for special applications

PCB thickness: 0.3～5.0mm

PCB weight: Max: 3KG

PCB board edge: 3mm, can be customized for special applications

PCB bending: ＜5mm or 3% of the diagonal length of PCB

PCB part height: Top: 35mm, Bottom: 75mm. Adjustable, can be customized for special applications

XY drive system: AC servo motor, precision ground ball screw

XY moving speed: Max: 830mm/s

XY positioning accuracy: ≦8um