Features:
Product Detail:
- 5 million pix full-color high speed digital camera (16/20 million pix optional), ensure high
efficiency, high quality and high stability of image shooting, restore the real and natural image effect.
- Windows 7 x64 operation system,high data processing speed.
- GPU independent hardware processing images, while CPU processing non-image computing,so as to balance the efficiency of computer system.
- Advanced and upgraded configuration and continuous technological innovation based on 6 series AOI products, high stability and efficiency.
- Optional telecentric lens with high resolution, unique parallel light design, PCBA tilted or tall components can be distinctly displayed.
- Intelligent and fast programming,intelligent algorithm, no need of manual intervention, easy to learn, high detection rate, low error rate.
- Flexible and mobile maintenance station and SPC checking terminal. Mobile devices under wireless network, working station can be set up flexibly on workshop in one to many mode: the detection data of multiple online machines can be checked through one maintenance workstation, the defect details are clearly reported. SQL data system are well-defined, SPC report with pie chat and histogram, very convenient for customer process analysis and quality improvement.
- Convenient and practical offline programming software OLP. PCB genuine image can be taken in real time and stored in full memory, ensure high efficient programming under circumstances of either online or offline.
Features
- Application: After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc.
- Program mode: Manual programming, auto programming, CAD data importing.
- Inspection items: Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
- Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
- DIP: Missing parts, damage parts, offset, skew, inversion, etc.
- Soldering defects: excessive or missing solder, empty soldering, bridging, solder ball, IC NG ,copper stain etc.
- Calculation method: Machine learning, color calculation, color extraction, gray scale operation, image contrast
- Inspection mode PCB fully covered, with array and bad marking function.
- SPC statistics function: Fully record the test data and make analysis, with high flexibility to check production and quality status.
- Minimum component: 01005 chip, 0.3 pitch IC
Hardwares:
- Camera: 5 million pix full color high speed industrial digital camera ,20 million pix camera optional
- Lens resolution: 10um/15um/18um/20um/25um, can be customized
- lighting source: Annular stereo multi-channel color light, RGB/RGBW/RGBR/RWBR optional
- CPU: Intel i7 3.40GHz
- RAM: 16GB
- HDD: 1TB
- OS: Win10 , 64bit
- Monitor: 22inch,16:10
- Moving andinspection mode: PCB moving automatically, L-R/R-L optional, step motor driving PCB and rails, XY servo motor driving camera.
- PCB dimension: 50*50mm(Min)~400*360mm(Max), can be customized.
- PCB thickness: 0.3~5.0mm.
- PCB weight Max:3KG.
- PCB edge: 3mm,can be customized base on need.
- PCB bending: <5mm or 3% of PCB Diagonal length.
- PCB component: Top:35mm,Bottom:75mm, adjustable, can be customized base on need.
- XY driving system: AC servo motor, precise ball screw.
- XY moving speed: Max:830mm/s.
- XY positioning accuracy: ≦8um.
- Machine dimension: L980 * W980 * H1620 mm.
- Power: AC220V,50/60Hz,1.5KW.
- Machine weight: 600KG.
- Air pressure: 0.4 – 0.8MPa.
- Safety standard: CE safety standard.
- Environment temperature and humidity: 10~35℃,35~80% RH.