Features

• Applicable process： DIP plug-in line before/after wave soldering, assembling or packaging line for home appliances, toys, etc.
  
• Programming mode： Manual writing, automatic writing, CAD data import, automatic corresponding component library, offline programming.
  
• Capabilities for defects detaction: missing part, broken, reverse, offset, skew, flipped, wrong part, broken, reverse, XY offset, etc.
  
• Calculation method: machine learning, color calculation, color extraction, gray scale calculation, image comparison, OCV/OCR, etc.
  

Parameters

• Camera: Top-mounted color high-speed global exposure industrial digital camera with 20 million pixels, supports shooting in motion.
  
• Lens resolution: 10um/15um/18um/20um/25um, can be customized for special applications.
  
• Light source: Top and side white LED panel light source.
  
• PCB size： 50*50mm(Min)～500*500mm(Max), can be customized for special applications
  
• PCB thickness： 0.3～5.0mm
  
• Pipeline running speed Max: 3.5m per minute
  
• PCB bending： degree <5mm, or 3% of the diagonal length of PCB
  
• PCB parts height： 50mm, adjustable, can be customized for special applications
  
• Equipment dimensions： L710mm * W600mm * H700 mm, height does not include signal lights